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Thermal Conductivity 6.0 W/mK, Operating Temperature -40 to 200C, Dimensions, 145×145 mm, Thickness 0.5 mm, Electrically non-conductive
Thermal Conductivity 6.0 W/mK, Operating Temperature -40 to 200C, Dimensions 145×50145 mm, Thickness 1,5 mm, Electrically non-conductive
Socket AM4, AM5, Fan Diameter 90 mm, Rotation Speed 100-2000 rpm, 4-pin fan connector, Pulse-width modulation (PWM) support, Heatsink Material Aluminum
LGA1156 Socket, LGA1155 Socket, LGA1150 Socket, LGA2011-3 Socket, LGA1151 Socket, Socket AM4, LGA2066 Socket, Fan Diameter 120 mm, Rotation Speed 200-2100 rpm, Pulse-width modulation (PWM) support, 4 heatpipes (6mm), Heatsink Material Aluminum
Viscosity: 870 poise, Density: 2.5 g/cm³, Continuous Use Temperature: -50~150 ℃, Volume Resistivity: 3.8 X 10^13 Ω-cm, Colour: gray.
Viscosity: 45000 poise, Density: 2.6 g/cm³, Continuous Use Temperature: -50~150 ℃, Volume Resistivity: 1.8 X 10^13 Ω-cm, Breakdown Voltage: 750 V/mil, Colour: Grey
Viscosity: 45000 Poise, Density: 2.6 g/cm³, Continuous Use Temperature: -50~150 ℃, Volume Resistivity: 1.8 X 1012 Ω-cm, Breakdown Voltage: 7.5 kV/m, Colour: Grey
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